FIELD: physics.
SUBSTANCE: invention relates to vacuum plasma deposition of a coating. Device comprises a process chamber in which a substrate holder with a substrate is installed, having O-O1 longitudinal axis, a discharge chamber with a helicon plasma source mounted on a process chamber symmetrically to the O-O1 longitudinal axis, a gas system, a solenoidal antenna located on the outside of the discharge chamber, and a magnetic system located on the outer side of the process chamber symmetrically to the O-O1 longitudinal axis and including the first solenoidal magnetic coil and the second solenoidal magnetic coil, made with the possibility of moving along the O-O1 longitudinal axis. Substrate holder is rotatable around the O-O1 longitudinal axis and movable along it. Device is equipped with at least one magnetron directed towards the substrate holder, made with the possibility of ionic stimulation of the coating deposition process and placed with the possibility of moving along the O-O2 axis located at an angle of 30–60° to the substrate plane.
EFFECT: increase in the rate and uniformity of deposition of the coating on the substrate, reduction of contamination of the coating by products of destruction of the walls of the process chamber is provided.
4 cl, 5 dwg
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Authors
Dates
2019-03-21—Published
2016-12-02—Filed