FIELD: instrument engineering.
SUBSTANCE: invention can be used for making MEMS devices. Essence of invention consists in the fact that method of plates separation into chips and production of through holes of large area for items of microelectronics includes application on reverse side of plate of polyimide film, applying on the front side of the plate a masking layer which is selective to plasma-chemical etching of the material of the plate, forming a pattern of cutting lines along the masking layer, through plasma-chemical etching of the plate to the polyimide film, removal of masking layer, removal of polyimide film, separation of plates into chips and removal of ballast sections.
EFFECT: providing the possibility of increasing manufacturability and quality of the obtained articles.
1 cl, 1 dwg
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