FIELD: electronic technology; microelectronics.
SUBSTANCE: invention can be used in the manufacture of integrated circuit (IC) crystals and discrete semiconductor devices, which are a thin plate. Essence: a method of temporary bonding for the formation of thin plates includes applying an adhesive and anti-adhesive layer, thermal compression connection of two plates, grinding or polishing the surface of the working plate to be processed, separating the working plate and the carrier plate, cleaning the surface of the working plate with an organic solvent, while the adhesive layer applied to the carrier plate, the anti-adhesive layer is applied to the working plate, an array of channels is formed in the carrier plate for etching the adhesive layer, and the thin working plate is separated by etching the adhesive layer.
EFFECT: reducing the level of defects and contamination on the surface of a thin plate.
1 cl, 7 dwg
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