FIELD: treatment of substrates.
SUBSTANCE: group of inventions relates to a device for the treatment of substrates by deposition or cleaning and to a method of processing using the specified device. The said device contains an external chamber, a reaction chamber with the possibility of feeding into it a chemically inactive gas or precursor, while the reaction chamber is located inside the outer chamber to form a two-chamber structure, a line for supplying a chemically inactive gas or precursor to the reaction chamber and a movable element located under the reaction chamber and configured to provide vertical movement of the reaction chamber between a processing position and a lower position within the outer chamber. The lower position of the reaction chamber is intended for loading into it at least one substrate. The said movable element forms part of the outlet line of the device. The specified method includes moving the reaction chamber to the lower position for loading at least one substrate into the reaction chamber, lifting the reaction chamber to the deposition or cleaning position for treating the specified at least one substrate by deposition or cleaning with the supply of a chemically inactive gas or precursor to the reaction chamber. After processing, the reaction chamber is again moved to the lower position and the at least one substrate is discharged.
EFFECT: improved method and apparatus are provided for loading and unloading substrates and minimizing particle generation.
15 cl, 8 dwg
