FIELD: technological processes.
SUBSTANCE: disclosed group of inventions relates to a substrate treatment apparatus for deposition and/or purification and a method of treating substrates using said apparatus. Said device comprises an outer chamber, a reaction chamber inside the outer chamber to form a two-chamber structure and a line for feeding chemically inactive gas or a precursor into the reaction chamber, a heater located inside the outer chamber outside the reaction chamber, a tube for feeding the radical and an outlet line located under the reaction chamber. Reaction chamber is movable between a processing position and a lower position inside the outer chamber, wherein a hole is formed for loading at least one substrate into the reaction chamber between its side wall and the tube for feeding radicals. Disclosed method comprises providing a reaction chamber inside an external chamber of a deposition or cleaning device in a processing position or a lower position for loading one or more substrates into a reaction chamber, lowering of reaction chamber to lower position for loading of at least one substrate into reaction chamber by means of formation of loading opening between side wall of reaction chamber and tube for supply of radicals. Then the reaction chamber is lifted to the deposition or purification position for sedimentation and/or purification. After treatment, reaction chamber is lowered to lower position and at least one substrate is unloaded.
EFFECT: enabling the possibility of loading and unloading substrates and minimizing or eliminating generation of particles from parts of said device, which are not a substrate.
15 cl, 8 dwg
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Authors
Dates
2020-07-22—Published
2017-02-08—Filed