FIELD: chemistry.
SUBSTANCE: invention is a method of forming a silicon oxynitride membrane with a thickness of 50 nm on a silicon substrate at a temperature of 380ºC, a pressure of 133 Pa, and at a flow of SiN4 – 390 cm3/min, N2O – 1300 cm3/min and NH3 – 1200 cm3/min, followed by heat treatment at a temperature of 850ºC for 10 minutes.
EFFECT: invention allows increasing the percentage of yield of suitable devices and improving their reliability.
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Authors
Dates
2021-05-04—Published
2020-09-24—Filed