FIELD: semiconductors.
SUBSTANCE: invention relates to the field of the manufacture of semiconductor devices. A device for separation of a metallized semiconductor plate after disc cutting includes a carrier located on a movable support plate with the possibility of movement along guiding runners, contains an upper part with structural elements located in parallel to cuts on the semiconductor plate, a lower support part, as well as an anvil, made with the possibility of a bending impact on the semiconductor plate by means of pneumatic pressure. Upper and lower support parts of the carrier are made in the form of pressing sheets, wherein the upper part of the carrier is made with a function of the anvil having technological holes, above which nozzles are located for passage of gas flows in a vertical direction above removed segments of the semiconductor plate, and the lower support part of the carrier is made with end faces located in parallel to cuts, while nozzles with holes made with the possibility of passage of gas flows in a direction at an angle to an anvil plane are made in end faces. In addition, the device additionally includes a unit for control of gas flows, containing air electric valves, a time relay, and a pressure reducer.
EFFECT: invention provides an increase in the yield of suitable photo-converters due to precise multiple bending of a back metallization layer during separation.
1 cl, 3 dwg
