FIELD: semiconductor devices.
SUBSTANCE: device for separating non-working segments of a metallized semiconductor wafer after disk cutting includes a carrier located on a movable support plate, configured to move along guide skids and containing an upper support part with structural elements located parallel to the cuts on the semiconductor wafer, as well as a lower support part made with the possibility of bending the semiconductor wafer by means of pneumatic pressure, while the upper and the lower supporting parts of the carrier are made in the form of pressure sheets, and the upper supporting part of the carrier is made with the function of an anvil, in which technological holes are located, above which nozzles for gas passage are located in the vertical direction above the removed non-working segments of the semiconductor wafer. The lower supporting part of the carrier is made with end faces located parallel to the cuts on the semiconductor wafer, while in the end faces there are nozzles with holes made with the possibility of gas flows passing in a direction at an angle to the anvil plane. A gas flow control unit is additionally introduced into the device, containing air electric valves, a time relay and a pressure reducer. The lower supporting part of the carrier is made with a rectangular side, equipped with marks in the form of two vertical through slots made with the possibility of their alignment with the pattern of the front metallization of the semiconductor plates, vacuum holes are made in the pressure sheet of the lower supporting part of the carrier, and multidirectional gas flows are created with the possibility of alternately separating non-working segments of the semiconductor wafer that are not in contact with each other, non-working segments accumulate in the receiving basket, in addition, the device is designed with the possibility of simultaneous processing of two halves of the semiconductor plates.
EFFECT: increased yield of suitable photoconverters resulting from increased productivity due to alternating separation of all non-working segments of the semiconductor wafer and the possibility of simultaneous processing of two halves of the semiconductor wafer.
1 cl, 6 dwg
