FIELD: electricity.
SUBSTANCE: use for unipolar positive supply of transistors in amplification circuits. Essence of the invention consists in the fact that in the proposed transistor design, which includes a substrate and a buffer layer, a GaN channel layer, a first barrier sublayer AlyGa1-yN, second barrier sublayer AlxGa1-xN, spatially separated electrodes of source, gate and drain, molar fraction of aluminium in second barrier sublayer is more than 50%, thickness of the first barrier sublayer is equal to 1–2 nm, thickness of the second barrier sublayer is 1–6 nm.
EFFECT: enabling reduction of electron density in the transistor channel.
1 cl, 2 dwg
Title | Year | Author | Number |
---|---|---|---|
FIELD-EFFECT TRANSISTOR | 2003 |
|
RU2222845C1 |
METHOD FOR MANUFACTURING A HIGH-CURRENT TRANSISTOR WITH NON-WALL OHMIC CONTACTS | 2022 |
|
RU2800395C1 |
SEMICONDUCTOR HETEROSTRUCTURE OF FIELD-EFFECT TRANSISTOR | 2006 |
|
RU2316076C1 |
MODULATION-DOPED FIELD-EFFECT TRANSISTOR | 2013 |
|
RU2539754C1 |
SEMICONDUCTOR ELEMENT EMITTING LIGHT IN ULTRAVIOLET RANGE | 2004 |
|
RU2262155C1 |
HIGH-POWER MICROWAVE FIELD-EFFECT TRANSISTOR BASED ON SEMICONDUCTOR HETEROSTRUCTURE | 2021 |
|
RU2781044C1 |
PSEUDOMORPHIC HETEROINTERFACE MODULATION-DOPED FIELD-EFFECT TRANSISTOR | 2013 |
|
RU2534447C1 |
METHOD FOR MANUFACTURE OF POWERFUL SHF TRANSISTOR | 2013 |
|
RU2534442C1 |
HETEROSTRUCTURE MODULATED-DOPED FIELD-EFFECT TRANSISTOR | 2013 |
|
RU2534437C1 |
HIGH-POWER SHF FIELD-EFFECT TRANSISTOR | 2014 |
|
RU2563319C1 |
Authors
Dates
2024-07-12—Published
2023-12-27—Filed