FIELD: electric elements.
SUBSTANCE: invention relates to the technology of making semiconductor devices which are sensitive to infrared radiation. Method of making a photodiode array according to the invention involves preparing the surface of an initial n-type indium antimonide plate, formation of doped regions of p-type conductivity, post-implantation annealing, application of dielectric layer of ZnS with thickness of 100-500 nm, wherein after post-implantation annealing, removing the native oxide layer of the n-type indium antimonide plate in a diluted solution of 1:10 concentrated hydrofluoric acid, mesa-elements are formed using a sequence of actions including formation of a photoresist mask with a given topology, chemical etching and an operation of "opening windows" by "explosive" photolithography.
EFFECT: invention enables to create a matrix photosensitive element with improved uniformity of distribution of density of states at the dielectric-semiconductor interface and fewer process operations.
1 cl, 1 dwg
Title | Year | Author | Number |
---|---|---|---|
METHOD FOR MANUFACTURING A MATRIX PHOTODETECTOR | 2022 |
|
RU2792707C1 |
ETCHANT COMPOSITION FOR OPENING WINDOWS IN HYBRID DIELECTRIC COATING | 2023 |
|
RU2811378C1 |
METHOD FOR FORMING A HYBRID DIELECTRIC COATING ON THE SURFACE OF INDIUM ANTIMONIDE ORIENTATION (100) | 2022 |
|
RU2782989C1 |
COMPOSITION OF MESA-ETCHING AGENT FOR INDIUM ANTIMONID ORIENTATION (100) | 2019 |
|
RU2699347C1 |
COMPOSITION OF MESA-ETCHANT FOR INDIUM ANTIMONIDE ORIENTATION (100) | 2020 |
|
RU2747075C1 |
PROCESS OF MANUFACTURE OF PLANAR P-N JUNCTIONS ON INDIUM ANTIMONIDE | 1991 |
|
RU2026589C1 |
METHOD OF MAKING PHOTODETECTOR ARRAY | 2007 |
|
RU2340981C1 |
METHOD OF THINNING PHOTOSENSITIVE LAYER OF MATRIX PHOTODETECTOR | 2022 |
|
RU2840324C2 |
METHOD OF MEASURING DARK CURRENT ON TEST MATRIX STRUCTURES WITH VARIABLE TOPOLOGY FOR DETERMINING PASSIVATION EFFICIENCY OF LARGE-FORMAT MATRIX PHOTODETECTORS WITH SMALL PITCH | 2024 |
|
RU2841177C1 |
METHOD FOR PREPARATION OF PHOTOELECTRIC TRANSDUCER | 2007 |
|
RU2354008C1 |
Authors
Dates
2025-05-21—Published
2024-12-02—Filed